YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
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Sector Specification(CM202-DS) Specification(CM201-DS) ModelNo. KXF-E24C KXF-E14C TactTime 0.088sec/chip 0.176sec/chip B'd change: 3.0 sec Centering method: Upward Vision PCB Size(L x
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Industry News | 2010-10-30 02:09:14.0
The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.
Industry News | 2019-12-09 16:03:06.0
Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey. Based on responses from 82 companies that make up a representative sample of the industry, global third-quarter 2019 sales growth, averaging 3.0 percent, was at its lowest level since the quarterly survey began in mid-2017. The sales growth the respondents predicted for the current quarter is down further, averaging 2.6 percent.
Parts & Supplies | Other Equipment
Juki KE2050, KE2060, FX-1, FX-3 P/N: E3665X-729-0A0 Des: Nozzle,#500 (0.5×1.0) P/N: #501 Des: Nozzle,#501 (0.7×0.4 / 0.25 Holes) P/N: #502 Des: Nozzle,#502 (0.7/0.35) P/N: #503 Des: Nozzle,#503 (1.0/0.6) P/N: E3656-729-0A0 Des: No
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Parts & Supplies | Other Equipment
I-Pulse smt pick and place nozzles SMT NOZZLES ON I PULSE MACHINES Machine i-Pulse M1,M4,M6ex,M7,M8 (P Type Nozzles) P/N: LG0-M7703-00 Des: Nozzle,M002 0.95mmx0.65mm P/N: LG0-M7703-00XS Des: Nozzle,M002 (modified) 0.7/0.45 P/N: LG0-M7
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Make: Universal Model: Genesis GI-07S – 4992C (With PTF) Vintage: 2012 SW: UPS+ 8.3.0.10. Details: • Linear X/Y • 7 spindle head • Nozzle changer • Magellan 2.3 camera • PTF mounted on rear Visit www.lewis-clark.c
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
: addition of the known smelter list, addition of declaration scope including product tab, and added and modified multiple questions and / or their responses. New
