Industry News: ila and 3

Joint IPC and UBM Canon Event Generates Sales and Solid Leads for Exhibitors and Valuable Technical Content and Contacts for Attendees

Industry News | 2010-10-30 02:09:14.0

The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.

Association Connecting Electronics Industries (IPC)

Electronics Manufacturers Report Slowing Growth and a Cautiously Optimistic Outlook

Industry News | 2019-12-09 16:03:06.0

Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey. Based on responses from 82 companies that make up a representative sample of the industry, global third-quarter 2019 sales growth, averaging 3.0 percent, was at its lowest level since the quarterly survey began in mid-2017. The sales growth the respondents predicted for the current quarter is down further, averaging 2.6 percent.

Association Connecting Electronics Industries (IPC)

Clariant turns the spotlight on 3D printed end use functional parts and new material for mobility and E&E trends at formnext 2019

Industry News | 2019-11-15 15:07:04.0

As intelligent industrial manufacturing gains a stronger foothold in production alongside the more established customization/prototyping arenas, Clariant returns to this year’s formnext with new solutions to support the growth. A new halogen-free flame retardant 3D printing material takes center stage alongside eye-catching and unique printed end use parts from a range of applications.

Clariant Cargo & Device Protection

IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard Establishes Requirements for Suppliers and their Customers

Industry News | 2014-04-11 09:15:04.0

IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.

Association Connecting Electronics Industries (IPC)

IPC Releases IMS/PCB Book-to-Bill Ratio and IMS/PCB Business Report for February 2003

Industry News | 2003-04-01 08:32:03.0

Recently selected IMS as a better designation for the PCB industry, to better reflect the services provided to customers.

Association Connecting Electronics Industries (IPC)

Apex Factory Automation and Interlatin announce new partnership - ILA Solutions!

Industry News | 2018-12-20 12:27:30.0

Apex Factory Automation and Interlatin announce they have teamed together to form a new partnership named ILA Solutions to serve Mexico, US and Canada markets for SMT equipment.

Apex Factory Automation

MacDermid Alpha to Exhibit and Present at TPCA and IMPACT

Industry News | 2021-12-13 12:52:59.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.

MacDermid Alpha Electronics Solutions

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

Henkel increases sales and earnings

Industry News | 2009-03-02 22:58:58.0

Business results reflect National Starch acquisition and Ecolab sale

Henkel Electronic Materials

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste

Industry News | 2015-10-13 19:27:42.0

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (

Shenmao Technology Inc.

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