USED EQUIPMENT (SMT,IMC,SCREEN PRINTER,REFLOW).e.t.c, and PCB ASSEMBLY
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Electronics Forum | Thu Sep 21 20:59:55 EDT 2017 | davef
There is no standard minimum / maximum IMC thickness. * There needs to be an IMC * Thinner IMCs are preferred over thicker IMCs
Electronics Forum | Tue Jul 14 07:23:50 EDT 2020 | researchmfg
There is a misunderstanding that people think the IMC layer grows the thicker the stronger soldering strength. The IMC layer can be grown and distributed evenly at the interface location will be good enough. Once the IMC layer grows too thick and ove
Used SMT Equipment | Pick and Place/Feeders
Online Auction,SMT Overseas Idle Equipment including: CAMALOT GEM1 （GEM12078）96--1Set CAMALOT GEM1 （GEM1-1103373-01）00--1Set Panasonic IMC-2（86T00261）--1Set Panasonic IMC-2（）--1Set The bidding event is about to begin, welcome to CS - Auctio
Used SMT Equipment | Pick and Place/Feeders
Panasonic IMC-2（86T00261）--1Set Panasonic IMC-2（）--1Set
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
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Parts & Supplies | Assembly Accessories
FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST
Parts & Supplies | SMT Equipment
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Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
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A technology that identifies the intermetallic compound formation, enables the system to provide closed loop feedback to the operator and validates the condition of the solder joint. This technology works in conjunction with SmartHeat® and patented C
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
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. Controlled tin flow direction; 5. The soldering surface does not move during reflow soldering. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC
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. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
