Electronics Forum | Thu Sep 21 20:59:55 EDT 2017 | davef
There is no standard minimum / maximum IMC thickness. * There needs to be an IMC * Thinner IMCs are preferred over thicker IMCs
Electronics Forum | Tue Jul 14 07:23:50 EDT 2020 | researchmfg
There is a misunderstanding that people think the IMC layer grows the thicker the stronger soldering strength. The IMC layer can be grown and distributed evenly at the interface location will be good enough. Once the IMC layer grows too thick and ove
Electronics Forum | Thu Aug 24 13:18:24 EDT 2000 | Dave F
What are the primary indium (In) / tin (Sn) intermetallic compounds (IMC)? What are the drivers to the formation of In/Sn IMC? Copper / tin IMC are very bittle and, while necessary for proper solder connection formtion, are ment to be minimized. W
Electronics Forum | Wed Oct 10 20:58:30 EDT 2001 | davef
Several points are: * There�s quite a bit of background on IMC in the fine SMTnet Archives. I�ll try not to duplicate it. * If you have a smooth and well-formed solder connection using fairly common materials, you assuredly will have IMC. Any evide
Electronics Forum | Tue Sep 24 18:38:54 EDT 2019 | researchmfg
Well, there may be a misunderstanding that people think the IMC layer grows the thicker the more strong soldering strength. Actually, the IMC layer can be grown and distributed evenly at the interface between Cu-based, Ni-based and Sn-solder will be
Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is
Electronics Forum | Mon Feb 21 21:28:13 EST 2005 | abhirami
Davef, We see increased IMC thickness for electroless Ni and the brittle mode failure occurs much earlier in multiple reflows, exposing IMC layers. Not good for board level reliability.Regards. GV
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
