Industry News | 2021-01-17 17:36:21.0
Nano Dimension Ltd. (Nasdaq: NNDM) offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/solutions/food-packaging-and-processing
asépticas incorporan materiales húmedos aprobados por la FDA, y aptos para Limpieza in Situ (Clean-In-Place, CIP) y Esterilización in Situ (Sterilize-In-Place, SIP
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
). Table 3. The effective CTE for 192CABGA and 84CTBGA measured by cross sectional Moiré. Accelerated Temperature Cycling The daisy-chained components and the test circuit boards enabled electrical continuity testing after surface mount assembly and in situ
