Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2019-05-23 10:27:13.0
The technical tips have offered valuable details and techniques into various aspects of electronics manufacturing. This has been validated by the reader responses concurring with our assessments, offering additional insight, or in some rare cases, stating divergent points of view on any particular matter. In a bit of a strategic departure from the normal range of electronic manufacturing topics, ACI Technologies,Inc. would like our readers to consider the importance of being well prepared in the arena of designed experiments in order to properly qualify a manufacturing process. This particular topic has relevance because of the associated scope of work ACI Technologies encounters in numerous projects from material R&D to manufacturing process optimization, which require appropriate experimental designs to ascertain the significant data.
Technical Library | 2019-05-24 09:24:49.0
Conformal coatings are applied to Printed Circuit Board Assemblies(PCBAs) using a variety of different methods. There are six main methods of applying conformal coatings: manual spraying, automated spraying, dipping, brushing, selective coating, and vacuum deposition.
Technical Library | 2019-05-29 10:40:59.0
Design for Test or Design for Testability (DFT) can best be described as the techniques utilized to add testability features to an electronic hardware product design. These added features make it easier to develop and apply manufacturing tests to assure that the product functions correctly.
Technical Library | 2019-05-29 10:42:23.0
Battery selection should be considered early during the design phase of affordable electronic systems. The important choice of an appropriate battery can reduce system acquisition costs and keep logistics support costs down for the life of the system.
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Technical Library | 2009-04-23 08:14:37.0
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result.
Technical Library | 2019-05-30 11:02:07.0
In a previous Tech Tip (see Battery Selection for Electronic Systems), considerations were discussed for selecting an appropriate battery for an application. After selection, testing should be performed to confirm that the battery can provide the power required for the specific application. Some battery definitions should be understood when discussing power load qualification testing of batteries.
Technical Library | 2019-06-11 09:34:37.0
Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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