Electronics Forum: incomplete wetting (Page 1 of 2)

Soldering to an OSB surface

Electronics Forum | Fri Jan 12 12:38:57 EST 2007 | maddog

Do you have any pointers concerning the oven setup and profile if you are soldering a module with bottom connections and gold pads to a pwb with an OSB finish? The solder paste is SnPb, no-clean. The paste mfgr. recommended profile produces voiding

Nordson Dage XD7600NT vs Nikon XTV160

Electronics Forum | Thu Apr 03 17:50:53 EDT 2014 | rboguski

We use it almost exclusively in manual mode for PCBA failure analysis. Our main purpose is to find head-in-pillow defects; secondarily incomplete wetting of ball to substrate. In two years of almost continuous use we have only had occasion to use t

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

I would like to invite everyone to share/discuss information/knowledge/experience they have with the req's that are assumed to be valid for the temperature/time relation in the process of reflow soldering Pin In Paste, Intrusive R

Re: non-wetting on gold land pad

Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F

Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in

Incomplete reflow

Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon

It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch

Lumpy joints

Electronics Forum | Fri Dec 14 13:58:07 EST 2001 | slthomas

This is one I haven't seen before (not in this context, anyway). We have an assembly that we have the SMT done out of house on, because of the high volumes. The boards have two distinct characteristics with respect to the appearance of the solder jo

Poor Solder on TSOP

Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval

We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo

Incomplete reflow

Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569

We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex

Re: Poor Solder on TSOP

Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi

  1 2 Next

incomplete wetting searches for Companies, Equipment, Machines, Suppliers & Information

https://pages.zestron.com/zestron-analytical-support-services

World's Best Reflow Oven Customizable for Unique Applications
Online IPC Training & Certification

PCB Assembly Supplies - ONLINE STORE
Benchtop Fluid Dispenser

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
PCB Cleaning

Private label coffee for your company - your logo & message on each bag!