LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater
Industry News | 2014-05-06 08:04:34.0
ZESTRON will host a free “Assembly, Cleaning, and Reliability” workshop together with Indium Corporation, Speedline Technologies, and Competitive Edge Solutions in Franklin, MA on June 10th, 2014.
Industry News | 2014-05-20 17:28:57.0
ZESTRON will host a free hands-on “Assembly, Cleaning, and Reliability” workshop together with Indium Corporation, Speedline Technologies, and Competitive Edge Solutions in Franklin, MA on June 10th, 2014.
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Professor Ron Lasky, Ph.D., Phil Zarrow, and Jim Hall discuss the SMT Processes Certification offered by SMTA. http://www.smta.org/certification/ Video production courtesy of Indium Corporation.
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Events Calendar | Thu Oct 01 08:30:00 EDT 2015 - Thu Oct 01 15:00:00 EDT 2015 | South Barrington, USA
Assembly Challenges of Small Packages - BEST 2015 Tech Symposium
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
. Eric Bastow, Indium Corporation Romel Bataluna, Jennifer Batt, L-3 Communications Telemetry-West Thomas Bauer, PRIDE Industries Edgar Bautista, Cisco Systems Octavio Bejarano, Cisco Systems Dennis
. Do you have any information that you could direct us to? Answer: I would start with supplier information, such as the flux manufacturers, AIM, Kester, Alpha, Indium etc