Industry Directory: indium silver solder (20)

Indium Corporation

Indium Corporation

Industry Directory | Manufacturer of Assembly Material / Soldering

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

AIM Solder

AIM Solder

Industry Directory | Manufacturer of Assembly Material / Soldering

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

New SMT Equipment: indium silver solder (249)

Delta 99C Lead Free Silver Free Alloy

Delta 99C Lead Free Silver Free Alloy

New Equipment | Solder Materials

Delta 99C Alloy = Sn/Cu/Ni/Ge has been developed to replace costly silver alloys in the soldering process. It’s widely used composition is an ideal drop in replacement for those currently using SAC and other  lead free alloys. Contains no

Qualitek International, Inc.

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Equipment | Solder Materials

Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu

Qualitek International, Inc.

Electronics Forum: indium silver solder (748)

2% silver solder paste

Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson

We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu

imm. silver

Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef

Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder

Used SMT Equipment: indium silver solder (3)

Koh Young KY8030-2

Koh Young KY8030-2

Used SMT Equipment | SPI / Solder Paste Inspection

Koh Young Ky8030-2 Solder Paste Inspection Machine D.O.M: 5/2012 Key Features: Innovation 3D Solutions for PCB Warp including Z-Tracking Technology and Pad Referencing Technology Renewal GUI features simple touchscreen operation that maximizes th

World Equipment Source / R1 Source, Inc.

Electrovert Lead Free EconoPak+

Electrovert Lead Free EconoPak+

Used SMT Equipment | Soldering - Wave

Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater

X-Line Asset Management

Industry News: indium silver solder (731)

GPD Global's MAX Series Provides Maximum Accuracy

Industry News | 2011-04-22 21:36:56.0

GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.

GPD Global

ZESTRON to Host Collaborative Hands-on Workshop “Assembly, Cleaning, and Reliability” in Massachusetts

Industry News | 2014-05-06 08:04:34.0

ZESTRON will host a free “Assembly, Cleaning, and Reliability” workshop together with Indium Corporation, Speedline Technologies, and Competitive Edge Solutions in Franklin, MA on June 10th, 2014.

ZESTRON Americas

Parts & Supplies: indium silver solder (16)

Technical Library: indium silver solder (214)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: indium silver solder (24)

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Videos

Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it

Qualitek International, Inc.

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

Events Calendar: indium silver solder (4)

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: indium silver solder (2)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: indium silver solder (915)

Partner Websites: indium silver solder (1512)

Silver Epoxy - Nordson ASYMTEK

Nordson ASYMTEK | https://www.nordson.com/en/divisions/asymtek/fluid-types/silver-epoxy?page=2

pump is an encoded auger pump with a floating head designed to make fast, repeatable dots of solder pastes, silver epoxies, and surface mount adhesives Valve - DV-8000C Heli-Flow Pump Nordson

Nordson ASYMTEK


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