Technical Library: infrastructure (Page 1 of 1)

Nike's Software Architecture and Infrastructure: Enabling Integrated Solutions for Gigahertz Designs

Technical Library | 1999-05-06 14:03:04.0

This paper describes how Nike’s innovative architecture addresses the expanding requirements of Intel’s next-generation processor designs while enabling a design environment that is more productive than one built with the previous tool generation.

Intel Corporation

Real-Time Yield Monitoring Through ERP Systems

Technical Library | 2007-04-25 21:54:26.0

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for the success of any manufacturing organization. An ERP system provides the infrastructure for consolidating all business operations by integrating the information flow across functions, including production planning and control.

i3 Electronics

Thick Film Polymer Resistors Embedded in Printed Circuit Boards

Technical Library | 2010-04-15 20:42:44.0

The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as well as the stability and tolerances necessary for widespread replacement of discretes. The focus of this work has been to develop a polymer thick film resistor technology to incorporate reliable organic resistors inside printed wiring boards using standard PWB processing.

DuPont

Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials

Technical Library | 2021-07-06 21:24:59.0

The amount of information transferred on wireless networks has increased dramatically with the tremendous growth of mobile phones, Internet access, and hand held devices. In order to build the infrastructure needed to handle ever increasing data transfer, manufacturers of electronic devices turn to high speed, high frequency electronic signals. The need to render these electronic devices portable is another technology driver. The merge of high-frequency signals with small geometry conductive traces means that the topic of signal loss has reached a critical point in existing device production.

MacDermid, Inc.

New High-Performance Organophosphorus Flame Retardant

Technical Library | 2015-09-10 15:06:17.0

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.

Albemarle Corporation

Where PCBs and Printed Electronics Meet

Technical Library | 2016-07-14 18:21:29.0

Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that make connections. Both PCB and PE technologies have been in use for a long time in one form or another with PCBs currently the standard for complex, high speed electronics and PE for user interface, complex form factor or other film based applications. New and innovative applications create the opportunity for promising structures. Taking advantage of the PCB shop's capability as well as the material set can help create these structures and indeed PE materials can find use in more traditional PCBs. New materials and new uses of existing materials open up many possibilities in electronic interconnecting structures. PCB manufacturers have a complex manufacturing infrastructure, well suited for both additive and subtractive conductor processing. While built around rigid material processing (flex PCB being the exception), there are opportunities for PE substrate processing. As electronics devices are applied to more and more parts of our lives, we need to continually push for better solutions. Fit, function, manufacturability, and cost are all important considerations. Crossing the PCB/PE boundary is a way to meet the challenge.

INSULECTRO

Green Supply Chain Management, Economic Growth and Environment: A GMM Based Evidence

Technical Library | 2018-05-30 15:31:21.0

The aim of this research is to examine the relationship between green logistics operations and energy demand, economic growth and environmental sustainability need to make factors for relationship clearer in a panel data of 43 different countries around the globe. The study employed panel Generalized Method of Moments (GMM) estimates for robust inferences. The results have revealed that logistics operations consume energy and fossil fuel, while the amount of fossil fuel and non-green energy sources create significant harmful effect on the environmental sustainability and also have negative effect on economic growth. In addition, poor transport-related infrastructure and logistics service are a major contributor of CO2 and total greenhouse gas emissions. However, carbon emission damages fauna and flora, and reduces economic growth. The findings suggest that renewable energy sources and green practices can mitigate harmful effect of logistics operations on environmental sustainability and spur economic activities with greatly export opportunities in a region.

Changan University

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