Electronics Forum: instruments dos 2d2s (Page 1 of 1)

Universal Instruments PPU Transferring programs?

Electronics Forum | Mon Sep 06 08:49:35 EDT 2004 | Tom B.

Ensure that there is no space or extra characters at the end of the line. Use "END" key, if cursor does not stop directly behind you insert code, then that is most likely our problem. I have found that MS-Dos Editor is better suited for PPU progra

Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory

| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon

| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon

| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con

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