Industry Directory | Distributor / Manufacturer
AOI Vision is the specialized supplier of advanced materials and engineering solutions for SMT PCB screen printing industry. We team up with industry leaders who are equipped with cutting edge technology and innovative products.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Test Equipment
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Electronics Forum | Tue Nov 07 14:34:04 EST 2006 | jeffm
We are using Kester Type R520A, Alloy SN96.5/A63.0/CU.5 paste which is applied using an MPM Accuflex machine. Our plant Humidity is 38 degrees. We are seeing insufficient paste post stencil on fine pitch parts. Could this be an environment issue? In
Electronics Forum | Thu May 24 19:27:50 EDT 2007 | kevinjm
We have a similiar problem with kester em907, a pb free paste. You say that your AOI system picks up blocked apertures, do you mean that the printers own camera looks at the stencil and sees apertures blocked? Or, is it picking up insufficient paste
Used SMT Equipment | SPI / Solder Paste Inspection
Model Number : KY3030-VAXL Serial Number : SPI-3X22 Manufacturer: Koh Young Technology Dimensions: 56x61x52 Condition: Used Solder Paste Inspection 24" x 27" panel size KY- VAXL is for XL boards EOS Replaced Vintage: 2006 Windows XP Profes
Used SMT Equipment | SPI / Solder Paste Inspection
Description: 3D Solder Paste Inspection System Vintage: 2016 O/S: Windows 7 Ultimate Details: • 4-Way High Speed Projection Upgrade (for KY8030-3) 3D Inspection GUI, Gerber conversion software • SPC Plus software(Statistical P
Industry News | 2014-02-17 20:17:14.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
(Statistical Process Control) Camera Barcode Reader (1D/2D barcode} Screen Printer Closed Loop Control Upgrade to Touch Screen Monitor UPS Insufficient Paste, Excessive Paste, Missing-Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position
KingFei SMT Tech | https://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
220V 50 / 60Hz Solder Paste Inspection Table Top 3D SPI-7500 Vision CE Leave a Message We will call you back soon! Your message must be between 20-3,000 characters