Industry Directory: insufficient solder root cause (1)

ACI Technologies, Inc.

Industry Directory | Consultant / Service Provider / Standards Setting / Certification / Training Provider

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

New SMT Equipment: insufficient solder root cause (18)

MPM® Edison Next Generation Scalable SMT Printer

MPM® Edison Next Generation Scalable SMT Printer

New Equipment | Printing

Unparalleled throughput and accuracy in an advanced next generation scalable printer platform. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets.  The Edison printer i

ITW EAE

Double Track Solder Paste Inspection Machine

Double Track Solder Paste Inspection Machine

New Equipment | Test Equipment

Inline Dual Track 3D SPI, Double track solder paste inspection mail:sales@smtlinemachine.com whatapp/wechat:+8615915451009 Specification: 技术平台/Technology Platform Dual conveyor Type-B/C 适用系列/Series S serials  型号M

CNSMT CO.LTD

Electronics Forum: insufficient solder root cause (318)

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

solder balls - Possible root causes

Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan

Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask

Industry News: insufficient solder root cause (116)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

Parts & Supplies: insufficient solder root cause (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: insufficient solder root cause (10)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

Videos: insufficient solder root cause (5)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

3D SPI manufacturer

3D SPI manufacturer

Videos

Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the

CNSMT CO.LTD

Training Courses: insufficient solder root cause (4)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Stencil Printing 101 Training Course

Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: insufficient solder root cause (2)

Reflow Simulation – X-ray & Optical Help Solves Design & Process

Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,

Reflow Simulation – X-ray & Optical Help Solves Design & Process

Surface Mount Technology Association (SMTA)

X-Ray of PCBs Webtorial

Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA

X-Ray of PCBs Webtorial

BEST Inc.

Career Center - Jobs: insufficient solder root cause (24)

SMT Maintenance Tech/Engineer

Career Center | Santa Clara, California USA | Maintenance

Coordinator and/or perform preventive maintenance/programming on SMT equipment. Troubleshooting, data analysis, root cause analysis, train SMT machine operators, follow and improve manufacturing processes. Must be familiar with DEK265 Printer, Fuji C

Coast Personnel Services

Wavesolder Process Engineer Wave Solder

Career Center | Danville, Illinois USA | Production

http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required

Watchfire Signs

Career Center - Resumes: insufficient solder root cause (25)

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Production Supervisor

Career Center | King, North Carolina | Management,Production,Quality Control

Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won

Express Newsletter: insufficient solder root cause (1000)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid

Partner Websites: insufficient solder root cause (108)

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

. Solder-Starved Joint A   solder-starved joint   is just that: a joint that does not have enough solder. Despite making the necessary electrical contact, the insufficient solder weakens the joint and increases susceptibility to cracking and failure

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5

Heller Industries Inc.


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