Industry Directory | Manufacturer
PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Wed Apr 02 23:02:38 EST 2003 | scottf
I agree with Iman. Verify the integrity of the component for moisture. Most definately place an amount of ownership on your PCB supplier. Request tank analysis results and copies of the lot travelers. Look specifically for any in process rework pro
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2001-11-06 11:24:10.0
IPC has announced its objectives for the future, which were recently approved by its Board of Directors at the 2001 IPC Annual Meeting in Orlando, Fla.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
(High Density Interconnect) technology is increasingly becoming the solution for smaller, more durable, and more efficient PCBs. HDI technology allows for lighter, smaller products that do more faster than ever before by leveraging blind and buried vias that can be staggered, stacked, and integrated with microvias
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-announces-further-orders-for-its-unique-patented-hot-pin-pull-test-method
strain rates, shock or thermal cycling which will result in the eventual failure of the interconnect. Nordson DAGE use a special technique called “Hot Pin Pull
