Industry Directory: interconnection (112)

Association Connecting Electronics Industries (IPC)

Association Connecting Electronics Industries (IPC)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

IPC is the trade association for the printed wiring board and electronics assembly industries.

Interconnecting Technologies

Industry Directory | Consultant / Service Provider / Manufacturer

PCB designing, PCB Manufacturing ,Reverse Engineering, Product Designing, Product Manufacturing ,Speed delivery of sample PCB

New SMT Equipment: interconnection (1657)

Component Identification Training

Component Identification Training

New Equipment | Education/Training

Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code

EPTAC Corporation

IPC Advance Design Certification

IPC Advance Design Certification

New Equipment | Education/Training

Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t

EPTAC Corporation

Electronics Forum: interconnection (154)

12Layers arbitrary interconnection HDI PCB Board

Electronics Forum | Mon Jun 24 03:17:31 EDT 2019 | jerry888

Hi All, Showing a nice 12Layers arbitrary interconnection SOM board we finished for a client. We provide lots of high complex HDI pcb boards for clients.such as 8L,10L,12L,14L(3+N+3,4+N+4 and arbitrary interconnection) HDI boards. Any friend need

Panel/Pallet Separating with Interconnects

Electronics Forum | Fri Jul 19 13:33:25 EDT 2002 | gdstanton

Dave, fyi...we decided not to go with the interconnects. At least during development phase due to excessive NRE to support the effort. However, we may revisit this when we come to production phase. Gregster

Used SMT Equipment: interconnection (36)

FocalSpot FSX-075eh

FocalSpot FSX-075eh

Used SMT Equipment | X-Ray Inspection

220X magnification provides excellent viewing of the smallest SMD electrical interconnections.  Easy-to-use  >220X magnification  Excellent imaging quality  Flexible board/part handling  Multipurpose inspection tool  Portable, small 32”x

Precision PCB Services, Inc

Electrovert Aquastorm 200

Electrovert Aquastorm 200

Used SMT Equipment | Board Cleaners

Angle Adjust Input Conveyor   Hurricane Jet Performance Package   Convenience Package   Gas Heat Option Includes (heater, transfer pump, and interconnect)   Resys ARS212 Recycle System   Upgraded Pumps and Blowers Auc

X-Line Asset Management

Industry News: interconnection (1038)

GPD Global to Debut New Technology for Fine Line and Nano Shot Dispensing at SEMICON West 2013

Industry News | 2013-06-10 17:08:51.0

GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company’s new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.

GPD Global

Parts & Supplies: interconnection (7)

Juki VG Mass Interconnect

Juki VG Mass Interconnect

Parts & Supplies | Hand Assembly

VG Mass Interconnect is a series of modular fixture products that allows quick connection between the UUT (unit under test) and a custom test system. VG mass interconnect is divided into 2 segments: Receivers (Tester Side), and Fixture Kits (DUT

Shenzhen PTI Technology CO.,LTD

Anda Automation VG Mass Interconnect Receiver

Anda Automation VG Mass Interconnect Receiver

Parts & Supplies | General Purpose Test & Measurement

VG Mass Interconnect products provide a common Universal interface for your custom test rack and simplifies functional test across your product line. Mass interconnect bench-top and rack mount receiver Plug and play interface blocks for signal, co

Shenzhen PTI Technology CO.,LTD

Technical Library: interconnection (83)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: interconnection (90)

Electronics in Harsh Environments Conference 2019 Summary

Electronics in Harsh Environments Conference 2019 Summary

Videos

Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh

Surface Mount Technology Association (SMTA)

Sharon Starr Discuss IPC Market Research Opportunities

Sharon Starr Discuss IPC Market Research Opportunities

Videos

The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex

Association Connecting Electronics Industries (IPC)

Training Courses: interconnection (83)

IPC J-STD-001 Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

Blackfox Training Institute, LLC

IPC J-STD-001 Trainer (CIT) Recertification Course

Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.

The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: interconnection (25)

Post – Moore's Law Electronics: From Now until Quantum Computing

Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,

Post – Moore's Law Electronics: From Now until Quantum Computing

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference

Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA)

Career Center - Jobs: interconnection (11)

Web Content Producer

Career Center | Cleveland, Ohio | Management,Production,Sales/Marketing

Responsible for the creation and production of web content for electronics interconnect industry-based web site. Coordinates the production of content from concept to broadcast. Writes and edits site content. Technically produces and directs live,

Solder.com

Sales Representative

Career Center | Independence, Ohio USA | Sales/Marketing

Solder.com is a new B2B exchange for the electronics interconnect and assembly industry. We are looking for an experienced sales representative to sell memberships and associated services to suppliers in the electronics manufacturing industry. This

Solder.com

Career Center - Resumes: interconnection (9)

Bob Riemer's resume

Career Center | Danville, California | Sales/Marketing

Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

Express Newsletter: interconnection (847)

Partner Websites: interconnection (70)

ACI Technologies, Inc

ACI Technologies, Inc. | https://www.aciusa.org/wp-content/uploads/2021/07/techtip7-2015.pdf

. Several examples of the stacking concept are shown in Figures 1 and 2. Figure 1: Wire bonded die stack. In many cases, die stacking results in a structure that requires the die interconnection wire bonds to be physically crossed

ACI Technologies, Inc.

High Density Interconnect (HDI) PCB Technology | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/

your search Close Search • HDI – High Density Interconnects Make the most of smaller components. Utilize HDIs (high density interconnection

Imagineering, Inc.


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Selective soldering solutions with Jade soldering machine

ONLINE IPC Training & Certification
Reflow Oven

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thru hole soldering and selective soldering needs

IPC Certification Training from the comfort of your home or office
2023 Eptac IPC Certification Training Schedule

Smt Feeder repair service centers in Europe, North, South America
BGA and SMD Rework Stations

ARE HUMIDITY INDICATORS PART OF YOUR SUPPLY NETWORK? Register for the webinar!