Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/
begin your search Close Search • HDI – High Density Interconnects Make the most of smaller components. Utilize HDIs (high density interconnection
| http://etasmt.com/te_news_bulletin/2021-08-31/23569.chtml
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23569.chtml
. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/support/training/training-course-descriptions
S2-900 Series Maintenance The Spectrum™ Series maintenance course provides an in-depth look at the dispensing system theory of operation and explores the function and interconnection of each subsystem
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder
| https://www.eptac.com/webinar/ipc-7095c-the-definitive-source-for-everything-bga/
the electronic devices that make this all possible. The BGA. IPC-7095C “Design and Assembly Process Implementation for BGAs” is fast becoming the key source for dealing with the assembly of this interconnection technology into the products of today
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/
. Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures
| https://www.eptac.com/news/eptac-corporations-leo-lambert-honored-for-industry-contributions-by-the-ipc/
. His service provided leadership for IPC Technical Programs and accomplishments, which contributed materially to the advancement of the electronic interconnection industry
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml
• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained