Industry Directory | Manufacturer of Components / Manufacturer of Assembled PCBs
ALMAX Electronic Interface Solutions (ALMAX EIS) is a global manufacturer of interface components and fully integrated interface assemblies.
Industry Directory | Manufacturer of Components
Manufacturer of high reliability, long-life test probes and sockets
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Fri Oct 23 18:13:53 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Electronics Forum | Fri Oct 23 15:15:51 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Used SMT Equipment | Pick and Place/Feeders
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
Parts & Supplies | SMT Equipment
YG200 INTERFACE BORD KGR-M4530-01X YG200 KEYBOARD KGA-M6590-000 YG200 SYSTEM UNIT KGK-M4200-101 KGK-M4200-00X YG200 VISION BOARD KGJ-M441H-02X KGJ-M441H-03X YG100 I/O CONVEYOR BOARD KGT-M4580-00X YV100XG D.POWER KM5-M5882-11X
KM1-M4592-11X VAC sensor board Part No. Part Name KGN-M5840-022 SERVO BOARD ASSY KGN-M5880-004 D.POWER BOARD ASSY KGN-M5810-305 DRIVER BOARD ASSY KV8-M4572-012 IO BOARD HEAD ASSY KGN-M5810-405 DRIVER BOARD ASSY KGT-M4580-012 IO CONVER
Technical Library | 2019-12-05 13:30:46.0
Conformal coatings are regularly employed to protect the surface of a soldered printed circuit board assembly from moisture, chemicals in the PCBA's service environment, and foreign objects or debris. Conformal coatings are nonconductive and therefore cannot be placed on any location where electrical contact will be required, such as connector pins, test points, and sockets. Conformal coatings are also not permitted on any mechanical interface location, such as mounting holes or brackets, to assure the proper fit between items in the final assembly. In order to apply conformal coatings to an assembly and comply with the restrictions on keep-out areas, masking is employed to protect those surfaces.
Technical Library | 2021-08-18 01:30:18.0
The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interfaced using connectors; this hinders the flexibility of the device and is prone to interconnect issues. Here, a single substrate interfacing approach is reported, where soft devices, i.e., sensors, are directly printed on Kapton polyimide substrates that are widely used for fabricating flexible printed circuit boards (FPCBs).
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com Don't miss this video, the contour mapping process maps gantry positions to those of a calibrated glass plate for highest level of accuracy when precision fluid dispensing is required. More Info: http://www.gpd-global.com/
Training Courses | ON DEMAND | | IPC-6012 Expert (CSE)
The IPC-6012 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-6012 standard.
Training Courses | ON DEMAND | | IPC-6012 Expert (CSE)
The IPC-6012 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-6012 standard.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jan 29 00:00:00 EST 2019 - Thu Jan 31 00:00:00 EST 2019 | Santa Clara, California USA
DesignCon - Where The Chip Meets the Board
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
Assembly Process Variables Voiding At A Thermal Interface News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effects of Assembly Process Variables On Voiding At A Thermal
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11738996-fh1255a0f-fuji-xp242-xp243-feeder-interface-board-adeee6700-pcb-smt-assembly.html
FH1255A0F FUJI XP242 XP243 Feeder Interface Board ADEEE6700 / PCB SMT Assembly Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
GPD Global | https://www.gpd-global.com/dispensing-thermal-interface-material.php
Dispensing Thermal Interface Material Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
