Cleanliness and contamination refers to the analysis of residues and particulate that are present in electronics assemblies and components that could be harmful to the function and reliability of the system. Using our ROSE (Bulk Ionograph) we can ch
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Electronics Forum | Tue May 22 19:28:31 EDT 2012 | Rick Thompson
Are there any established acceptance criteria for contaminants based on Ion Chromatography testing? I've found some references to certain levels for some contaminants but there doesn't seem to be any industry consensus. Any feedback or reference to l
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
Technical Library | 2023-12-26 17:50:54.0
In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
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SMTA China East Conference 2018
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
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I am having autonomous mechanical and electronics system design, maintenance, installation,.
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I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
SMTnet Express, April 29, 2021, Subscribers: 27,195, Companies: 11,344, Users: 26,617 Failure Analysis – Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS) Since the 1980s the electronics industry has utilized ion
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-98-User-Guide-20030320-PBT-002D-FORCEWare-v3-01.pdf
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