Industry Directory: ionic cleanliness no clean (2)

Advanced Cleaning Solutions

Industry Directory | Cleaning

Our services include precision PCB cleaning and ionic cleanliness testing/verification using either the Omega 600 or Zero Ion

Foresite Inc.

Industry Directory | Cleaning / Test Services / Consultant / Service Provider

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

New SMT Equipment: ionic cleanliness no clean (19)

VIGON® US - Flux Removal Agent for PCB's

VIGON® US - Flux Removal Agent for PCB's

New Equipment | Cleaning Agents

VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic hybr

ZESTRON Americas

VIGON® A 250 - Water Based PCB Defluxing Agent

VIGON® A 250 - Water Based PCB Defluxing Agent

New Equipment | Cleaning Agents

PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formulation, VIGON® A 2

ZESTRON Americas

Electronics Forum: ionic cleanliness no clean (84)

assembly cleanliness and ionic testing

Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller

i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.

Cleanning no clean residu

Electronics Forum | Mon Oct 22 08:54:27 EDT 2007 | rgduval

Michael, You're right, of course. A major mis-type on my end. What I meant to say is that no-clean fluxes are designed to not _require_ cleaning to meet industry cleanliness standards. Cheers ..rob

Industry News: ionic cleanliness no clean (151)

“Thermal Profile Variation and PCB Reliability” by Jigar Patel, Senior Application Engineer, ZESTRON, to be presented at APEX 2016

Industry News | 2016-02-24 19:52:18.0

ZESTRON is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Application Engineer, ZESTRON, will present “Thermal Profile Variation and PCB Reliability” during the Flux Reliability II session on Thursday, March 17th, at APEX 2016.

ZESTRON Americas

Naveen Ravindran, ZESTRON Americas, to Present at Texas Reliability in Electronics Workshop

Industry News | 2017-09-28 19:59:35.0

ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer, will present “Reflow, Multiple Thermal Cycles and Cleaning No Clean Solder Paste and the Impact on PCB Reliability" at the Reliability in Electronics Workshop on October 17th in Austin, Texas and October 19th, in Richardson, Texas.

ZESTRON Americas

Technical Library: ionic cleanliness no clean (4)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Cleanliness/Corrosion Mitigation

Technical Library | 2019-09-27 09:14:41.0

One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode.

ACI Technologies, Inc.

Videos: ionic cleanliness no clean (4)

HeatShieldGel(TM)

HeatShieldGel(TM)

Videos

To order, visit http://www.solder.net/products/heatshieldgel-tm/ BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic compo

BEST Inc.

Nu/Clean Aqua Batch

Nu/Clean Aqua Batch

Videos

See the Nu/Clean Aqua Batch Aqueous Batch Cleaner in operation! Quick, quiet, close loop cleaning at a great price! For technical specifications, visit our website www.TechnicalDev.com.

Technical Devices Company

Events Calendar: ionic cleanliness no clean (3)

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Surface Mount Technology Association (SMTA)

PCBA Cleanliness End-of-Project Webinar

Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,

PCBA Cleanliness End-of-Project Webinar

iNEMI (International Electronics Manufacturing Initiative)

Express Newsletter: ionic cleanliness no clean (667)

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Cleanliness of Stencils and Cleaned Misprinted Circuit Boards There are long-established standards and test methods for ionic cleanliness levels for bare printed circuit boards

Partner Websites: ionic cleanliness no clean (539)

Clean Dispensing Needles

ZESTRON Americas | https://www.zestron.com/en/cleaning-applications/smt-electronics-cleaning/maintenance-and-tool-cleaning/dispensing-needles.html?option=com_content&view=714&Itemid=58

Virtual Tour Japan Analytical Center Cleanliness and Surface Qualification Ionic Contamination Ion Chromatography Technical Cleanliness Visual Inspection Bath Analysis Cleaning Process Support Cleaning

ZESTRON Americas

SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succe

| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/

: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question


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