Water-based Cleaning Medium for Reflow and Wave Solder Equipment. Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-cond
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
Electronics Forum | Tue Oct 31 21:49:38 EST 2006 | davef
First, we assume the white residue is only on the connector and not on other components. That would imply that either: * White stuff was on the connector when it came in-house from your supplier. [Confirm this theory by baking some connectors from
Industry News | 2016-03-30 20:18:20.0
KYZEN today announced plans to exhibit in Stand C111 at NEPCON Korea, scheduled to take place April 6-8th at the COEX Exhibition Center in Seoul. The company’s cleaning experts will showcase safe IPA alternatives that help improve the cleaning process and increase production yields.
Industry News | 2016-06-15 20:28:29.0
KYZEN today announced plans to exhibit in Stand B05 at NEPCON West China, scheduled to take place June 21-23, 2016, at the New International Convention & Exposition Center in Chengdu, China. KYZEN’s cleaning experts will showcase safe IPA alternatives that help improve the cleaning process and increase production yields.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Based on its MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes and emissions from assemblies. It is also recommended for
KYZEN Offers IPA Alternatives for Stencil Cleaning at productronica India KYZEN: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions Zum Inhalt springen Suche Sie suchen das Sicherheitsdatenblatt