Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
IPC is the trade association for the printed wiring board and electronics assembly industries.
New Equipment | Education/Training
This latest version D of the IPC-A-610 released in Released February 2005, Presented in a one day class this is a must for all quality assurance and assembly departments. IPC-A-610D illustrates industry-accepted workmanship criteria for electronic
Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | SMT Equipment
Fuji SP4,Cp6, Ip3 spare parts for sales... Part No. Description Qty. M/C 030E1 SOLENOID 030E1-DC24 5 IP3 A1022F KQN04-M5 6 IP3 A1040C FS2-62 2 IP3 A1067A FE7B-FDB6-M5 2 CP3-4 A1067A FE7B-FDB6-L5 2 CP3-4 A5161T O-RING 2 CP AQOH8011 JOINT ROTARY 2 I
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Parts & Supplies | Pick and Place/Feeders
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Parts & Supplies | SMD Placement Machines
PANASERT / UNIVERSAL / DYNAPERT PARTS FOR SALE N434UQ04041 Tube BLKE01252 FUSE 5A 40833025 FUSE 1.5A 42453904 FUSE 5A 42453907 FUSE 1A 46347803 Relay 40525301 SHOCK ABSORBER KXF0DSSAA00 46849802 SENSOR 46347803 RELAY 47323702 PROX SWITCH PNP N
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Jan 29 00:00:00 EST 2018 - Mon Jan 29 00:00:00 EST 2018 | Rolling Meadows, Illinois USA
IPC-A-610
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Per the IPC-A-610 , a PCB with more than 5 solder balls (<=0.13mm) within 600mm² is defective, as a diameter larger than 0.13mm violates the minimum electrical clearance principle
Blackfox Training Institute, LLC | https://www.blackfox.com/about/instructors/
Electronic Manufacturing IPC Training Instructors - Blackfox Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
