New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-1001 Capacity: 657 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acce
Electronics Forum | Fri Mar 19 03:13:35 EDT 2010 | mun4o
Hi, First check what the Moisture Sensitivity > Level of the LEDS is....you may need to ask the > LED manufacturer. Once you've established it is > moisture sensitive then follow latest version of > IPC JEDEC 33 spec. for storage of them and dryi
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2019-08-12 20:12:26.0
IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for Functional Fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
| https://ipcapexexpo.org/exhibitors/eac-terms-and-condtions
Exhibitor Appointed Contractors (EAC) Terms and Conditions | IPC APEX EXPO 2021 Skip to main content Toggle navigation Exhibitor Menu Become an Exhibitor Why Exhibit? What's Included
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
component storage, environment used to store component until soldered, and handling methods used on the component until soldered. Solderability of component leads is included in EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC is the trade association for the printed wiring board and electronics assembly industries.
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