A value-priced high-performance printing solution designed to meet the demands of high-volume production The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series p
Yamaha YSM40R High-Speed Modular SMT Chip Mounter ❙ Features of Yamaha YSM40R Yamaha Ultra-High speed modular pick and place machine YSM40R, Yamaha modular chip mounter, Achieves revolutionary productivity of 200,00
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Used SMT Equipment | In-Circuit Testers
The Anritsu MS2721A is the most advanced ultra-portable spectrum analyzer on the market, featuring unparalleled performance and size at a modest price. This is a high performance handheld spectrum analyzer. The MS2721A is the first fully-functional h
Used SMT Equipment | In-Circuit Testers
R&S CMU200 Universal Radio Communication Tester - The multiprotocol tester for today's mobile radio networks. Providing SPEED, ACCURACY and MODULARITY. Test Equipment Connection prices start at $18,000 for a basic unit, additional options are extr
Industry News | 2020-04-02 14:42:58.0
Due to the ongoing COVID-19 pandemic, Blackfox is offering online IPC training and certification beginning in mid-April.
Industry News | 2012-04-27 15:25:26.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released a series of interchangeable cup nozzles for Universal Instruments’ Flexjet 2/3/Inline 7 (7 Spindle) equipment.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Parts & Supplies | Circuit Board Assembly Products
Specifications: 1. Adopt hardened metal, service motor, transfer motor,original.best price 2. Gross weight:0.5-2.0kg. 3. out packing:carton 4. inner packing: original packing. 5: lead time:within 2 working days Applications: Business Organi
Yamaha YSM40R High-Speed Modular SMT Chip Mounter ❙ Features of Yamaha YSM40R Yamaha Ultra-High speed modular pick and place machine YSM40R, Yamaha modular chip mounter, Achieves revolutionary productivity of 200,00
Training Courses | ONLINE | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
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A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-instructor/ipc-a-610-cit-recertification/
) certification and recertification. Instructors will obtain the knowledge to: Interpret the differences between Class 1, 2, and 3 products Reference the IPC-A-610 standard to make accept/reject decisions Proficiently conduct CIS training courses per IPC requirements Correctly
Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/
. Today’s blog will cover this topic and help shed some light on this vital topic. Learn more about the classifications below. Class 2 and Class 3 Standards These are quality standards established by IPC-A-610 that were created to better define the rules for building electronic assemblies
