| https://www.eptac.com/faqs/ask-helena-leo/ask/cup-terminal-soldering-requirements
: I have a couple of questions regarding cup terminals. J-STD-001, IPC-A-610 and IPC-A-620 all require solder to be “visible” in the inspection hole (if present
| https://www.eptac.com/ask/cup-terminal-soldering-requirements/
: I have a couple of questions regard cup terminals. J-STD-001, IPC-A-610 and IPC-A-620 all require solder to be “visible” in the inspection hole (if present
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
detector allows you to easily navigate samples and identify defects quickly. Easily ensure IPC-A-610 and IPC-7095 compliance with in-built tools for dimension measurement, BGA void analysis, bump diameter and roundness and through hole filling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-5-x-ray-inspection-system
. Inbuilt automated tools for BGA quality analysis, bump diameter and roundness, wire sweep, solder and QFN voiding make quick work of finding defects, helping you achieve IPC-A-610 and IPC-7095 compliance
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
? Posted on 5th June, 2012 by Mark Pilkington Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Well
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. X-ray inspection enables you to implement manufacturing standards such as IPC-A-610 (Acceptability of Electronic Assemblies) and IPC-7095 (Design and Assembly Process Implementation for BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/smt
ermöglicht die Inspektion von großen Backplane-Platinen, die in Servern und für 5G verwendet werden. Mit der Rönt geninspektion können Sie Fertigungsstandards wie IPC-A-610
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