Electronics Forum | Thu Apr 12 00:56:20 EDT 2007 | Jani
Our SMT production and storage area is air-conditioned, constant temperature is maintained but the humidity is not controlled , the raw SMT material is stored in a "Drier" cabinet, but since we assemble hybrid SMT and thru-hole PCB assemblies, the SM
Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas
Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo
Electronics Forum | Thu Apr 12 22:00:58 EDT 2007 | davef
Search the fine SMTnet Archives, for instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=46687
Electronics Forum | Wed Apr 11 19:32:39 EDT 2001 | Adam
I'm trying to find information/articles describing the effects of temp and humidity on solder paste. Just recently we have gone through a change outside temperature and humdidty and have notice solderabilty problems with smt boards.
Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef
OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because
Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc
Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat
Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart
IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c
Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef
James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin
The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class
