for missing balls (BGA's - figure 23), or bent or missing l
| https://www.eptac.com/soldertips/soldertips-how-long-should-it-take-to-create-a-solder-joint/
complete the creation of the joint. Subsequently the time to clean the joint also has to be included in this time, but the operators can clean more than one joint at a time so you have to figure an average time to do so many solder joints
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) surface finish. Figure 8 illustrates a completely assembled test vehicle without the ribbon cable used for monitoring current continuity. Micro- vias in accordance with IPC-6012 Class 3, Type 4 and IPC 2315 Type II were placed in the component pads to
