New SMT Equipment: is50 (11)

high power reliable oem aluminum pcb for led light board

high power reliable oem aluminum pcb for led light board

New Equipment | Fabrication Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a highquality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board a

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

China 0.2mm BGA multilayer pcb manufacturer

China 0.2mm BGA multilayer pcb manufacturer

New Equipment | Fabrication Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

Electronics Forum: is50 (1)

Double-sided reflow with a Altera 240-pin RQFP

Electronics Forum | Mon Jun 30 16:35:13 EDT 2003 | davef

Hi Steve We don�t double reflow this part. We wouldn�t consider it without a fixture or some other support. You know that sound, the almost involuntary sound that patrons in a restaurant make when a waiter drops a glass or a tray? It�s kind of an

Technical Library: is50 (2)

A PROM Element Based on Salicide Agglomeration of Poly Fuses in a CMOS Logic Process

Technical Library | 1999-05-07 10:18:34.0

A novel programmable element has been developed and evaluated for state of the art CMOS processes. This element is based on agglomeration of tVarious aspects of these programmable devices including characterization and optimization of physical and electrical aspects of the element, programming yield, and reliability have been studied. Development ofhe Ti-silicide layer on top of poly fuses.

Intel Corporation

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Technical Library | 2018-09-26 20:33:26.0

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

AIM Solder

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