Industry News: isothermal cycling (Page 1 of 1)

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

Solder Joint Reliability

Industry News | 2018-10-18 08:49:15.0

Solder Joint Reliability

Flason Electronic Co.,limited

Speedline Displays New Technologies at APEX 2016, MPM, Electrovert, and Camalot Products

Industry News | 2016-02-24 15:04:42.0

Coming off a highly successful global launch at Productronica in November, the MPM Edison printing system makes its North American debut at this year's Apex show. As the next generation in printing technology, with patented features throughout its design, the Edison operates at twice the speed and with 25% more accuracy than other printers. With an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, the Edison is capable of reducing your total cycle time by as much as 15 seconds as compared to competitive printers (includes stencil wipe and printing).

Speedline Technologies, Inc.

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