New Equipment | Education/Training
We can arrange an online consultancy meeting to discuss specific process problems or product failures you are experiencing or to consider process improvement options with your engineering team. We have been providing practical hands on failure analys
The 18 page colour poster guide is available and was produced to accompany our workshops run at ITRI. The photographic guide is ideal as a reference source to reduce the impact of counterfeit components on your organisation and is provided as a pdf f
Electronics Forum | Fri Jun 07 08:37:24 EDT 2002 | davef
Kay Nimmo [ http://www.itri.co.uk/soldleg.htm ] knows what's happening. Ask her to tell us.
Electronics Forum | Sat Mar 25 07:25:34 EST 2006 | davef
Russ Who benefits? * Tin producers [ITRI] and sales-types * Equipment producers and sales-types * Friends, relatives, red-haired children, and sycophants of Euroland legislators working in the regulation and compliance activities relating to leadfre
Industry News | 2001-02-06 17:50:22.0
The Interconnection Technology Research Institute (ITRI) has announced that Jerry Siegmund has accepted the position as ITRI CEO. Siegmund, who served as a senior marketing executive for Circuit-Wise Inc. before his retirement in 1997, has been active in the electronics industry since 1959. He was named to the IPC Raymond E. Pritchard Hall of Fame in 1997.
Industry News | 2010-06-16 12:45:24.0
BANNOCKBURN, IL — The Solder Products Value Council (SPVC) of IPC — Association Connecting Electronics Industries® issued the organization’s position statement on conflict metals during a Supply Chain Workshop held on May 20, 2010, by the Electronic Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI) in Vancouver, British Columbia.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Bob Willis "How to Do It" video clip explains how to test solderability of terminations in a production environment in a few seconds. The test is simple and show if a process problem you are facing is related to process, components, paste or other fa
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Events Calendar | Wed Oct 25 00:00:00 EDT 2017 - Fri Oct 27 00:00:00 EDT 2017 | Taipei, Taiwan
IMPACT 2017, 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference
| http://etasmt.com/cc?ID=te_news_bulletin,25161&url=_print
. It’s time to do some homework. The IPC, ITRI (The International Tin Research Institute) and NEMI (National Electronics Manufacturing Initiative
.gif)
