Electronics Forum: jianbiao pan (1)

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef

Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia

Industry News: jianbiao pan (2)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

DEK Honors Continuing Education Commitment, Donates Printing System to Cal Poly

Industry News | 2009-07-21 11:50:50.0

Upholding its pledge to support educational advance that promotes electronics innovation, DEK announces that it has donated a Horizon 03i printing system to California Polytechnic State University (Cal Poly), San Luis Obispo, further enabling the institution’s “learn by doing” approach.

ASM Assembly Systems (DEK)

Technical Library: jianbiao pan (9)

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

Technical Library | 2010-04-29 21:40:37.0

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Flex (Flextronics International)

Gold Embrittlement In Lead-Free Solder.

Technical Library | 2014-08-07 15:13:44.0

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.

DfR Solutions

Express Newsletter: jianbiao pan (70)

SMTnet Express August 29 - 2013, Subscribers: 26233

SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick

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