Input voltage 220V Work ability At the same time 1 bottle or 2 bottles of mixed soider paste Motor speed 1350RPM Revolution speed 500PRM Rotation speed 200PRM Applicable scope Adapt to a
PCB cutting machine/PCB depaneling machine/PCB separator ASC-700 model from ASCEN technology co.,ltd The more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This mac
Electronics Forum | Tue Nov 01 20:40:03 EDT 2011 | mikeincal
What may be happening is an early trigger of your vacuum sensors during production due to a clogged tip or vacuum line in the head. What happens during production is that the Y axis gets into position, and then the vacuum sensor input is monitored on
Used SMT Equipment | General Purpose Test & Measurement
Features Simultaneous multichannel measurement All-in-one instrument for measuring SDH/SONET, PDH/DSn, OTN, Jitter performance Supports 10 M/100 M/1000 M, Gigabit, and 10 Gigabit Ethernet measurements High accuracy jitter measurement Descripti
Used SMT Equipment | General Purpose Test & Measurement
The HP 3784A is a portable error performance/jitter test set, offering standard telecom interfaces at 704 kb/s, 2, 8, and 34 Mb/s. In addition it has binary TTL/ECL interfaces for measurements up to 50 Mb/s using internal clock synthesizer.5 The HP 3
Industry News | 2008-08-22 17:39:57.0
Agilent Technologies Inc. (NYSE: A) today introduced advanced software for making precise phase-locked loop (PLL) measurements, also called jitter transfer measurements. Used with the Agilent 86100C DCA-J wideband oscilloscope, the software can test a wide variety of PLL designs and has been approved by the PCI-SIG(r) (PCI Special Interest Group) to perform PCI Express(r) (PCIe) PLL compliance measurements.
Industry News | 2008-02-03 22:10:38.0
Agilent Technologies Inc. (NYSE: A) today introduced a precision waveform analyzer designed specifically for engineers involved in design verification and validation of high-speed electrical communications systems and components.
Technical Library | 2016-06-30 14:00:32.0
When designing PLLs in nanometer CMOS, it is essential to validate the closed-loop PLL performance metrics with nanometer SPICE accuracy before going to silicon. Transistor-level, closed-loop PLL verification has been impractical due to traditional SPICE and RF simulator performance and capacity limitations. By using Analog FastSPICE, designers dont have to trade accuracy for performance. Read this white paper to see how AFS: Delivers closed-loop PLL transistor-level verification Supports direct jitter measurements Produces phase noise results correlating within 1-2dB of silicon
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
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Events Calendar | Tue Jan 29 00:00:00 EST 2019 - Thu Jan 31 00:00:00 EST 2019 | Santa Clara, California USA
DesignCon - Where The Chip Meets the Board
| http://etasmt.com/cc?ID=te_news_bulletin,18561&url=_print
. In order to ensure that the circulating gas acts on any area of the printed board, the airflow must have a sufficiently fast speed, which to a certain extent easily causes the jitter of the printed
Whizz Systems | https://www.whizzsystems.com/semiconductors-back/
. The PCB supplies power and interconnects the ASIC while also being responsible for RF-matching, noise and jitter performance, heat dissipation, oscillation tendencies suppression, EMI suppression and much more
