K & F Electronics has been manufacturing PCB's since 1972. We specialize in quick turn PCB's. We are RoHS capable, ISO 9001:2008, ITAR, IPC, UL approved. Visit our website https://circuitboards.com/ for more information.
Cambia Automation Limited has thousands of new PLC parts, DCS module in stock, plus fast, high-quality of all Bently Nevada, Allen-Bradley, Honeywell, ABB parts, all with a 1-year warranty. Our inventory includes the hard-to-find ICS Triplex T8461 a
Electronics Forum | Fri Sep 12 09:21:59 EDT 2003 | Gabriele
Yes for sure you can use MV2F feeder on MV2VB, the only difference is MV2VB feeder have better design (more robust)then MV2-F type. For sure you have to take care do not mix "K" type with "Q" type feeders who are not compatible among them. Ciao.....
Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke
We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t
Facilities: 100 - 120V / 10A Dims: 14"W x 18"D x 5"H @ 16lbs Product Terms: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by
JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
KV1-M663R-000 YAMAHA Yamaha Mounter FEEDER Accessories Stove KV1-M663R-000 YAMAHA Yamaha Mounter FEEDER Accessories Stove Email:firstname.lastname@example.org Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.zghuanan.com KGA-M6590-000 KGA-M6590-00X E
03029073-02 Modul Head Interface mirrored complete X 03029113-01 machine facing cover sheet 03029123S03 CPU-PCB. SMP16-CPU086 1,6GHz 768MB 03029170-01 Lifting Table Single Conveyor, GS 03029171-02 Lifting Table Dual Conveyor, GS 03029178-01 guid
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
SMT FUJI Cp6 Cp7 Cp8 Washer, Lock W1019t Wph0780 FUJI SMT Machine Parts email@example.com FUJI 13189 LAMP HALOGEN (R1022A) (R1022A) FUJI 100003 Absorber shock KSHA6X15-47W TO A1037W FUJI 100119 ASTRO BELT TIMING 10T5/1500 20.114.01 FU
Career Center | San Pedro Sula, Cortes Honduras | Engineering,Maintenance,Management,Technical Support
Preventive maintenance on SMT machines. Corrective maintenance on SMT Machines Schedule of preventive maintenance programs. Minimum Inventory control for spare parts Automation process on SMT Lines Work Instructions for maintenance procedur
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
High Temperature Seal Option Expanded low viscosity sealing For temperatures between 260-343°C (500-650°F) Retrofittable design In This Section Product Type Screen Changers Nordson Screen Pack *NEW* FlexDisc™ *NEW
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