New SMT Equipment: keithley 2000 (118)

keithley DAS-1801HC/1802HC DAS-1802HC

keithley DAS-1801HC/1802HC DAS-1802HC

New Equipment | Industrial Automation

   MANAGER : Tiffany Guan EMAIL:sales@askplc.com WEB:http://www.askplc.com Skype:dddemi33 Mb(Whatsapp):+86 18030235313 Wechat:+86 18030235313 SPECIFICATION Min. Order   1 Piece

Askplc Limited

Keithley 2000 Digital Multimeter

Keithley 2000 Digital Multimeter

New Equipment | Test Equipment

The 2000 combines broad measurement ranges with superior accuracy specifications - DC voltage from 100nV to 1kV (with 0.002% 90-day basic accuracy) and DC resistance from 100µOhm? to 100MOhm (with 0.008% 90-day basic accuracy). Optional switch cards

Recon Test Equipment Inc.

Used SMT Equipment: keithley 2000 (3)

Keithley 2000

Keithley 2000

Used SMT Equipment | In-Circuit Testers

Keithley 2000 The Model 2000 6.5-Digit Multimeter is part of Keithley's family of high performance DMMs. Based on the same high speed, low noise A/D converter technology as the Model 2001 and 2002, the 2000 is a fast, accurate, and highly stable

Test Equipment Connection

Keithley 2000

Keithley 2000

Used SMT Equipment | In-Circuit Testers

Keithley 2000 The Model 2000 6.5-Digit Multimeter is part of Keithley's family of high performance DMMs. Based on the same high speed, low noise A/D converter technology as the Model 2001 and 2002, the 2000 is a fast, accurate, and highly stable

Test Equipment Connection

Technical Library: keithley 2000 (5)

Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Technical Library | 2017-02-16 16:53:49.0

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.

Auburn University

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Technical Library | 2007-11-01 17:16:07.0

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,

i3 Electronics

Express Newsletter: keithley 2000 (170)

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