Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
PCB solder paste printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD) for Reflow Soldering. Automatic PCB solder paste screen printer with pecial
Electronics Forum | Wed Jan 26 14:33:47 EST 2000 | Glenn Robertson
Tuan - How about Sn/0.7Cu? It's M.P. is 227 and it's readily available. If the leads are Gold plated you might consider pre-tinning them. If you need a higher temp alloy any of the major solder companies can help - I suggets you start with Ind
Electronics Forum | Wed Jan 26 13:43:06 EST 2000 | Tuan Bui
221 degree C) to achieve good wetting and shiny filet. Comments and recommedations are welcome.
Industry News | 2011-03-28 13:24:06.0
Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
| https://www.smtxtra.com/shop/machine-sales/dek-horizon-03ix-full-automatic-solder-paste-printing-machine-year-2015-sn-309725/
: 230V, 50/60Hz, 1 Phase Air Pressure: 5-8 Bar Dimensions (mm): 2060 x 1500 x 1570 Weight: 800Kg DEK Horizon 03IX full-automatic solder paste printing machine multifunctional plate handling device can automatically position and clamp PCB of various sizes and thickness, with removable magnetic
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
pressure required to inject the solder paste into the mesh or the drain hole; The sticky friction of the solder paste causes the solder paste to produce a shear at the intersection of the smc printing machine scraper and the mesh plate
