Automated Desk Dispensing Machine - Efficient and Convenient ❙ Introduce of Desk Automatic Dispensing Machine Semiconductor packaging, PCB electronic parts fixation and protection, mobile phone, notebook shell bonding, LCD glass substrate packag
About the machine please contact whatsapp 0086 134 2516 4065 PGB-810system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
Electronics Forum | Thu Apr 28 11:14:27 EDT 2005 | bbarr
If you apply the RTV after coating, what happens to bond strength since you are now bonding to the coating and not the board? Will the caps still survive vibration and shock? I specify applying RTV before coating for this reason. Am I correct? I als
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Parts & Supplies | Pick and Place/Feeders
Product Description SMT nozzle pick and place machine NXTII H04 1.0 R19-010-155 AA06W07 assembly Place of Origin:China( Mainland ) Brand Name: FUJI Model Number: AA06W07 TYPE: nozzle
Parts & Supplies | SMT Equipment
Product Description FUJI nozzle NXT H08/12 1.3 AA73700 use for FUJI SMT pick and place machine Place of Origin:China( Mainland ) Model Number: AA73700 TYPE: nozzle MOQ:1PCS
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
About the machine please contact whatsapp 0086 134 2516 4065 D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric enviro
| https://www.smtfactory.com/I-C-T-is-always-Keeping-Improving-the-Comprehensive-Strength-id46753977.html
I.C.T is always Keeping Improving the Comprehensive Strength - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) and they have a long list of defects which I’ve attached along with the table of minimum bond strength. 3.2.1 Failure category. Failure categories are as follows
