Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN
Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Tue Jul 27 06:04:16 EDT 2004 | cyber_wolf
Grant, I know of a couple places that throw their paste out at the end of the day. I have worked in SMT for over 15 years and we have never thrown paste out unless it was contaminated, or dried out. We have never had a problem. If you ask me, I would
Electronics Forum | Tue Aug 25 21:01:45 EDT 1998 | Peter
We use an Intermec 3240 Thermal transfer printer and print on polyimid label material that survives the reflow and wave solder (top side only) process without turning black. Labels run around 3-4 cents per depending on the size (We found Imtec label
Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary
Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over
Electronics Forum | Tue Sep 14 08:46:31 EDT 2004 | scombs
I'm currently working for a OEM that has 700+ stencils in house and we received 30 to 40 stencil a month. We recently switched to a no clean process which is causing the stencil part numbers to disappear from the stencil frames due to the saponifier
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