Electronics Forum | Wed Dec 13 13:42:57 EST 2000 | Mike Ihm
The dielectic absorption characteristic of printed circuit board materials is usually not listed on the manufacturers spec. sheets. Can anyone point me in a direction to help determine which laminate materials might exhibit better dielectric absorpt
Electronics Forum | Fri May 27 05:18:25 EDT 2011 | aj
Hi all, Looks like this laminate is becoming extinct... What have you switched to if you were a user? AJ...
Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110
I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with
Electronics Forum | Thu Aug 02 16:28:16 EDT 2007 | gregs110
Maybe much more detailed than you have available but do you know the exact prepreg number you were using in the failed units? That is one of the only similarities I have been able to isolate on my parts - I am curious if it may be the same. Thanks,
Electronics Forum | Thu Aug 02 18:00:09 EDT 2007 | swag
I'm not sure what it was. It would be tough information to get as it's an old issue and sore spot with our supplier. I'm not even sure if we use them anymore for these boards.
Electronics Forum | Wed Aug 01 18:14:13 EDT 2007 | swag
We had the same trouble. We baked our boards out but the delamination continued very random. One board would be fine and the next was a nasty explosion of delam. Switched material - no problems since. I never found out the technical reason behind
Electronics Forum | Wed Jun 01 01:08:43 EDT 2011 | boardhouse
Hi Aj, for the most part we have gotten away from calling out specific material and instead calling out IPC4101 back slashes to needed requirements. But if you are just looking for what most domestic shops have switch to you would be looking at 370
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Wed Jul 09 16:12:01 EDT 2003 | Matt Kehoe
Right-o Dave, Thats the 2 lifted pads turned upside down so actually you are looking at the bottom of the base copper where it used to be attached to the laminate. mk
