Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
Electronics Forum | Tue Nov 16 18:02:29 EST 1999 | John Holland
What are the main advantages of moving from a 140 degree C FR4 laminate to a higher Tg laminate 180 degree C ?. Would the higher Tg laminate be less susceptable to bow and twist ?. John Holland
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Used SMT Equipment | Pick and Place/Feeders
The parameters of the Star CP40LV patch machine Samsung CP40LV parameter Samsung CP40LV mount speed: 8000 CPH / H(IPC9850) servo system: servo motor drive X, Y axis-Z axis mobile drive system mount head: 3 mount heads, With fixed camera CP40LV Samsun
Used SMT Equipment | Board Cleaners
2011 AQ Zero ion board contamination tester available: * 120VAC Power Requirement. * Large Board capacity 24x24 * New OEM All in One Computer with Windows based O/S. * ESD Safe Laminate Work surface with ESD Grounding. *Test Solution (not inclu
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Assembly Accessories
The product description YG12 head Z axis servo controller control board YAMAHA YG12 head IO board Z axis servo board YS12 head Z axis servo board head servo controller, Z axis servo control board YAMAHA YG12 head Z axis servo board head Z axis servo
Parts & Supplies | Pick and Place/Feeders
BarcodeLaminate X-Feeder Sector 2
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
03022171S01 BOLT / COVER STRIP DISPOSAL X44 03022172S01 BOLT / COVER STRIP DISPOSAL X44 03022173S01 BOLT / COVER STRIP DISPOSAL X72 03022236S03 trailing-cable unit SIPLACE X-Series 1P 03022237S03 trailing-cable unit SIPLACE X-Series 2PU 03022256
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Consider the options-How should I mask for Conformal Coating?
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
– A prepreg is a sheet of woven-glass fabric that holds a resin in place, which is heated to become extremely hard. It allows for the bonding of different laminates and foils
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/flexural-test
, particularly composites and polymers. Flexural testing is used to determine the elastic modulus and failure strain of laminates. The manufacturing process for laminates involves a number of steps that impact the mechanical properties of the final board
