Industry Directory: land patterns (4)

PCB Libraries, Inc.

PCB Libraries, Inc.

Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other

PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.

SMT Plus Inc.

Industry Directory |

SMT Plus offers online and onsite technical training in addition to selling technical publications for SMT design and manufacturing. SMT Plus is a leader in supplying land pattern libraries to the industry.

New SMT Equipment: land patterns (14)

IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard

New Equipment | Education/Training

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c

BEST Inc.

Electronics Forum: land patterns (212)

SMD land patterns design for wave soldering

Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno

I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha

SMD land patterns design for wave soldering

Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef

Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from

Industry News: land patterns (74)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

IPC Offers Enhanced PCB Library Documentation with IPC-7351 Land Pattern Standard

Industry News | 2013-05-20 16:19:35.0

IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.

Association Connecting Electronics Industries (IPC)

Videos: land patterns (7)

How to make sure you're using the most recent revision of IPC standards

How to make sure you're using the most recent revision of IPC standards

Videos

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

Association Connecting Electronics Industries (IPC)

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method.

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method.

Videos

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:

BEST Inc.

Training Courses: land patterns (2)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: land patterns (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: land patterns (2)

PCBA New Product Introduction Engineer

Career Center | Auckland, New Zealand | Engineering

NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res

Navman NZ LTD

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Career Center - Resumes: land patterns (1)

Cad designer

Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development

Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).

Express Newsletter: land patterns (87)

Partner Websites: land patterns (7177)


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