Industry Directory: large bga (19)

reflowsystems

Industry Directory | Manufacturer of Assembly Equipment

www.reflowsystems.com, your site for hi-tech reflow ovens: small benchtop models for prototyping and large conveyor models. Our speciality: 1) leadfree and BGA soldering, 2) zero defect profile builder, 3) energysaving passive mirror heaters !

Torrent Assembly Group

Torrent Assembly Group

Industry Directory | Manufacturer of Assembled PCBs / Other / Test Services / Turnkey / Contract Manufacturer

Fully automated assembly, advanced product introduction processes. ISO quality system compliance, high standards for medical, military, and other discerning markets. Quick turn prototyping, lower cost per engagement inc. low volume prod.

New SMT Equipment: large bga (393)

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

The next level of refinement, the Quantum™ Q-6800 Series is Nordson ASYMTEK’s latest high-performance, large-format dispensing platform. The Quantum platform has the same large dispense area as Axiom with a laser height sensor (LHS) while new sophis

Nordson ASYMTEK

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

Nordson ASYMTEK

Electronics Forum: large bga (237)

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Wed Sep 08 20:23:28 EDT 2004 | KEN

Philips Emerald & Emerald-X is specified at max 54mm device. However I have placed 58mm devices. These machines have published accuracies at 0.02mm. Have seen as low as 0.007mm.

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Thu Sep 09 04:19:27 EDT 2004 | Simon UK

I think if the machine has the capability of multiple fields of view (Quad systems do!) You can mesure any device with the visual camera to circa 80mm2. Simon

Used SMT Equipment: large bga (43)

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Samsung Supply of SAMSUNG Samsung Tablet CP63/CP40/SM321 / CP45FV/SM421 / Price concessions

Used SMT Equipment | Pick and Place/Feeders

SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee

KingFei SMT Tech

Contact Systems 3Z SMT Placement Machine

Contact Systems 3Z SMT Placement Machine

Used SMT Equipment | Pick and Place/Feeders

Remanufactured and tested to the OEM specifications. The 3Z places a full range of components from small chips to large, fine pitch devices and BGA's. It features a vision and positioning system with the extreme accuracy required for ultra fine p

Versatec

Industry News: large bga (180)

Europlacer to Showcase Assembly Lines, Storage and Integrated CFX Functionality at APEX 2019

Industry News | 2019-01-22 12:36:28.0

Europlacer Americas announces that it will exhibit two SMT assembly lines in Booth #2511 at the upcoming 2019 IPC APEX Expo. The high-speed line will feature the company’s award-winning, ultra-flexible atom3 placement machine downstream from the advanced EP710 AVi Screen Printer. The mid-range, very-large-board manufacturing solution consists of the company’s flagship iineo+ Multi-Functional Placement System with advanced LED binning in line with its EP1220 Long Board Screen Printer.

EUROPLACER

Nordson ASYMTEK's Next Generation Dispensing and Conformal Coating Systems and Software to be on Display at IPC APEX 2016 Booth 1841

Industry News | 2016-03-09 16:11:24.0

Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.

Nordson ASYMTEK

Parts & Supplies: large bga (133)

Panasonic MV/MMC/MSH/MSR/MPAV/MSF/MCF/HDP/HD/CM/DT Panasonic smt nozzle

Panasonic MV/MMC/MSH/MSR/MPAV/MSF/MCF/HDP/HD/CM/DT Panasonic smt nozzle

Parts & Supplies | SMT Equipment

MV MV2 MV2C MV2F MV2VB Series Nozzles Part Number Description 1020 1750 15XX Nozzle, RSS(S), #1 (Shinny Tappered Tip) 1020 1530 00 Nozzle, M-1.2, #2 1020 1795 61xx Nozzle, M-1.6, #2 1020 1795 00xx Nozzle, L, #3 1020 1750 11xx

KingFei SMT Tech

Fuji NXT nozzle NXT-H01-7.0G (AA07300/AA07310)

Fuji NXT nozzle NXT-H01-7.0G (AA07300/AA07310)

Parts & Supplies | Pick and Place/Feeders

NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F

KingFei SMT Tech

Technical Library: large bga (204)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Videos: large bga (35)

Solder Paste capabilities with the SV-100 Slider Valve

Solder Paste capabilities with the SV-100 Slider Valve

Videos

Dispensing dots, lines and into recessed cavities. Video was shot with a lipstick camera mounted to the dispense head. http://www.nordsonasymtek.com

Nordson ASYMTEK

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Career Center - Resumes: large bga (3)

SMT Process Engineer

Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support

• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,

Production Supervisor

Career Center | King, North Carolina | Management,Production,Quality Control

Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won

Express Newsletter: large bga (578)

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Partner Websites: large bga (925)

Practical and reliable BGA solder ball technology

| https://www.nextpcb.com/blog/BGA-solder-ball-technology

:04:14 PM June 10, 2021 writer: Jack BGA solder Ball Technology Introduction BGA as a large-capacity packaged SMD has promoted the development of SMT

BGA Rework Station - ML-G200 - QYSMT

| https://www.qy-smt.com/product-item/bga-rework-station-ml-g200/

BGA Rework Station - ML-G200 - QYSMT HOME ABOUT US PRODUCT & SERVICE Panasonic JUKI YAMAHA FUJI SAMSUNG SIEMENS HITACHI & I-PULSE UNIVERSAL ASSEMBLEON SANYO & SONY DEK


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High Precision SMT Fluid Dispensers

Real Time Process Control BREAKTHROUGH for Dispensing Industry.
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