Industry Directory | Manufacturer
Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.
GS Praezisions AG is a Swiss manufacturer of flex and rigid flex circuit boards. We spezialize in miniaturization and produce chip on board and flip chip substrates with micro via in laser and plasma technology among standard multilayer HDI PCBs.
New Equipment | Selective Soldering
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
New Equipment | Selective Soldering
Enhanced, entry-level, single point selective soldering system With all the proven features of the Jade MKII, the Jade MKIV sets even higher standards of performance. Designed to meet the needs of the small/medium batch manufacturer who requires hi
Electronics Forum | Mon Feb 06 15:50:10 EST 2006 | ajaygarg1980
Hi, We are electrodepositing Au(0.25 to 0.5 microns) on Cu & using solder ball bonding process via laser.We are getting lots of voids within the solder (not kirkendall voids). Can anyone shed some light on this problem.We are not using any flux.Pre
Electronics Forum | Thu Apr 03 11:14:05 EDT 2008 | johnivanov
Hello, I need names of good, reliable PCB houses capable of doing 4 mil laser drilled vias. Any input is appreciated. Thanks,
Used SMT Equipment | General Purpose Test & Measurement
Configuration: Laser pointer Description: The repair station displays pcb faults detected by the VT-9000 and the Trion-2000 optical inspection systems on a monitor. Its purpose is to help repair personnel qu
Used SMT Equipment | General Purpose Test & Measurement
Agilent Keysight E8361A 67 Ghz PNA Network Analyzer This and 400+ other quality test systems available via online auction. Please visit www.xlineassets.com for details. Auction starts soon!!! Equipment Manufacturers: Agilent/HP Tektronix
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Industry News | 2017-04-03 15:02:09.0
MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Visker Model: 8mm Part Name: Feeder Driver: Motorized Lead Time: Within 3days Machine Model: JUKI All Model SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder Description: Model:
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: THK Model: MG70 Part Name: Grease Gun Unit Usage: Grease Lead Time: Within 3days Machine Model: JUKI All Model THK Grease Gun Unit Original For JUKI Surfact Mount Machine MG70 Description: Model: MG70
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Lumberton, USA | Engineering,Production
Metal Etching Technology Inc. is one of the United States leading Manufacturers of solder paste stencils for the electronics industry. Candidate's responsibilities will include printing and manipulating cad data, transferring files via internet/em
SMTnet Express, October 6, 2016, Subscribers: 26,499, Companies: 14,980, Users: 41,213 Figure 1-An IoT PCB Using Rigid-Flex Construction PCB Laser Depanelizing Using a UV Laser Bob Wettermann; BEST Inc. One of the methods gaining in popularity
Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
GPD Global | https://www.gpd-global.com/co_website/benchtop-dispense-robot.php
: automatic vision, laser surface sensing, and nozzle alignment. Our tabletop dispensing robot provides you with accurate and repeatable dispense results
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