Electronics Forum | Wed Oct 11 15:40:34 EDT 2006 | Steve Gregory
Don't think there's any easy way to clean under a LCC, but you might want to consider this: http://www.winslowautomation.com/ccmd.asp A dead simple way to mount solder columns onto LCC's and then solder the part to the PCB with a stand-off of abou
Electronics Forum | Mon May 19 19:32:50 EDT 2003 | Dave
Hello. We have a low profile LCC on a board. The clearance is ~ 2mils after reflow. Cleaning away residual flux with an ultrasonic 50C water cleaner caused some LCC and 0201 components to loosen. Should we stay away from the ultrasonic cleaner?
Electronics Forum | Tue Jul 01 12:22:09 EDT 2008 | gpe.
Hi, I have a question fou you guys: Is there any difference between LCC's and QFN's? or, Are those just two terms to call the same part? Thanks for your help. Gpe.
Electronics Forum | Wed Oct 04 16:21:52 EDT 2006 | russ
Cannot see you cleaning under this type of part with aqueous no matter what you try Russ
Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks
QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.
Electronics Forum | Tue Jul 01 13:40:32 EDT 2008 | gencinas
Thanks Real Chunks. Gpe.
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Wed Aug 20 10:27:25 EDT 2003 | Dan Gosselin
Do any of you guys have a list of parts that cannot survive hanging upside down during reflow soldering. As our board designs become increasingly dense and higher speed, we need to use all available pcb real estate. This means locating parts we hi
Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
