Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Assembly Services
Microchip New and Original KSZ9563RNXC-TR in Stock IC VQFN-64 package KSZ9563RNXC-TR 3-Port Gigabit Ethernet Switch with 1588v2 ADG821BRMZ-REEL7 MSOP8 ADI 22+ ADUM 6402ARWZ SOP16 ADI 22+ XC7S50-2FTG
New Equipment | Assembly Services
Nexperia New and Original PSMN1R4-40YLD in Stock IC SOT-669-5 package PSMN1R4-40YLD Power inductor (SMD type) WE-HCI 1.5uH 11A DCR=6.6mOhms AECQ200 ADG821BRMZ-REEL7 MSOP8 ADI 22+ ADUM 6402ARWZ SOP16 ADI 22+
Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Industry News | 2008-07-19 15:38:37.0
OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
TI New and Original OPA2241UA in Stock IC SOP8 , 22+ package OPA2241UA Dual, 5V Single-Supply, Micropower Operational Amplifier Today's Hot Deals： AD7689BCPZRL7 LFCSP20 ADI 2021+ 5M240ZT100I5N SC70-5 Altera 2021+ ADS1120IPWR DFN-5 TI 22+
TI New and Original LMZ13610TZE/NOPB in Stock IC TO-PMOD-11 , 21+ package LMZ13610TZE/NOPB 10 A SIMPLE SWITCHER® POWER MODULE WITH 36V MAX INPUT VOLTAGE Today's Hot Deals： AD7689BCPZRL7 LFCSP20 ADI 2021+ 5M240ZT100I5N SC70-5 Altera 2021+
| https://www.wesource.com/miscellaneous/adbvin-system-pilot-u128-plus-universal-device-programmer/
. PILOT-U128-Plus provides true low voltage support for new devices that require low levels of Vcc and digital inputs. All device technologies are supported and all package types are supported by Advin-made modules
