Industry Directory: lead contamination on solder pot (1)

Lepla srl

Industry Directory | Consultant / Service Provider / Manufacturer

Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.

New SMT Equipment: lead contamination on solder pot (5)

Selective Soldering System-H

New Equipment | Selective Soldering

Selective Soldering System-H Specifications: MODEL HPS 4/46 HPS 4/35S Equipment parameters Dimension(L×W×H) 2450x1845x1565 (mm) 2450 x 2055 x 1665 (mm)

Samtronik International Limited

Dual Fluxer Wave Soldering Machine 20" Width NEW

Dual Fluxer Wave Soldering Machine 20" Width NEW

New Equipment | Wave Soldering

New SMT Series LW2000 Wave Solder • CE Certified • 5 Year Dual Solder Pot Warranty • 2 Year Warranty all other Parts • Direction: Left to Right • PCB Process Width: 1.97 - 20 Inches • Advanced Optional Features Included: Dual Fluxer System: Dual spr

SMT Devices

Electronics Forum: lead contamination on solder pot (118)

Solder pot contamination

Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN

I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav

contamination on copper

Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef

Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th

Industry News: lead contamination on solder pot (68)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Industry News | 2016-02-10 15:50:38.0

SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.

Surface Mount Technology Association (SMTA)

Technical Library: lead contamination on solder pot (1)

Characterize and Understand Functional Performance Of Cleaning QFN Packages on PCB Assemblies

Technical Library | 2022-12-19 18:59:51.0

Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.

iNEMI (International Electronics Manufacturing Initiative)

Express Newsletter: lead contamination on solder pot (1033)

SMTnet Express - August 12, 2021

SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article

Partner Websites: lead contamination on solder pot (301)

Dual Solder Nozzle Pot and Pump

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/dual-solder-nozzles

. - Fully compatible with 3-25 mm quick change magnetically coupled bullet nozzles and 4-25 mm mini-wave solder nozzles. - Available for tin-lead or lead-free solder alloys with lead-free solder pot constructed of titanium for resistance to corrosive alloys

ASYMTEK Products | Nordson Electronics Solutions

SN100C Lead-Free Bar Solder

| https://pcbasupplies.com/sn100c-lead-free-bar-solder/

SN100C Lead-Free Bar Solder Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick


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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411