Industry Directory: lead forming thermal pad (17)

AI Technology, Inc. (AIT)

AI Technology, Inc. (AIT)

Industry Directory | Adhesives / Dispensing

Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.

TennMax Inc

TennMax Inc

Industry Directory | Manufacturer of Components

TennMax Inc is EMI and Thermal Management Specialist. We offer total solutions for any EMI and thermal applicatons.

New SMT Equipment: lead forming thermal pad (646)

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

New Equipment | Solder Materials

DSP 825HF is a lead-free, no clean, halogen-free solder paste designed specifically for a wide range of lead-free alloys. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combine

Qualitek International, Inc.

MX-5210 Dual Port Simultaneous Soldering and Rework System

MX-5210 Dual Port Simultaneous Soldering and Rework System

New Equipment | Rework & Repair Equipment

New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production solder

Metcal

Electronics Forum: lead forming thermal pad (274)

Solder short-BGA with thermal pad

Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto

If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal

forming axial-lead for elavated horizontal soldering to SMT pad

Electronics Forum | Wed May 26 05:05:04 EDT 2004 | curious

hi, we have a batch-rework for a axial 2-lead LED component. we are thinking of bending both ends of the axial-leads into a L-shape at 90degree angle, and solder the flat-end of the L-shape flatly to the PCB's SMT pad. hope the experienced guys/exp

Used SMT Equipment: lead forming thermal pad (8)

Ekra E4

Ekra E4

Used SMT Equipment | Screen Printers

EKRA E4 AUTOMATIC SCREEN PRINTER Auction Item: www.xlineassets.com Complete Manufacturing Closure Other Available Equipment Includes: Assmebleon MG1 and Topaz X Pick and Place Assembleon Feeders Ekra Screen Printers Electrovert Vectra Wave S

X-Line Asset Management

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Pick and Place System Auction Item: www.xlineassets.com Complete Manufacturing Closure Other Available Equipment Includes: Assmebleon MG1 and Topaz X Pick and Place Assembleon Feeders Ekra Screen Printers Electrovert Vectr

X-Line Asset Management

Industry News: lead forming thermal pad (330)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

Nordson ASYMTEK

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

Nordson ASYMTEK

Parts & Supplies: lead forming thermal pad (7)

Juki JUKI 501 NOZZLE

Juki JUKI 501 NOZZLE

Parts & Supplies | Chipshooters / Chip Mounters

> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI

ZK Electronic Technology Co., Limited

Chimall pcb1

Chimall pcb1

Parts & Supplies | Circuit Board Assembly Products

PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic

PULANG TECHNOLOGY CO,.LTD

Technical Library: lead forming thermal pad (428)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Technical Library | 2009-07-01 09:24:25.0

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

ZESTRON Americas

Videos: lead forming thermal pad (24)

PCB Library Expert

PCB Library Expert

Videos

The PCB Library Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footp

PCB Libraries, Inc.

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: lead forming thermal pad (9)

IPC-7711/7721 Trainer (CIT) Recertification Course

Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.

The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.

Blackfox Training Institute, LLC

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: lead forming thermal pad (41)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: lead forming thermal pad (3)

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Resume

Career Center | kerala, any ware India | Production

i have experience in                                                                           • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi

Express Newsletter: lead forming thermal pad (762)

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend

Partner Websites: lead forming thermal pad (310)

Component Prep Lead Forming PBFT

GPD Global | https://www.gpd-global.com/co_website/video-prep.php

Component Prep Lead Forming PBFT   Home   Products Fluid Dispense Systems High Precision Dispenser - MAX Series Large Format Board Processing - DS Series Table Top Manufacturing Loader

GPD Global

IPC-7093A BTC: QFN Solder Mask Defined Thermal Pad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html

IPC-7093A BTC: QFN Solder Mask Defined Thermal Pad - PCB Libraries Forum   Forum Home > Libraries > Footprints / Land Patterns    New Posts    FAQ    Search    Events    Register

PCB Libraries, Inc.


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