Technical Library | 2012-03-22 20:40:01.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
Technical Library | 2024-01-15 20:45:42.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Technical Library | 2024-01-16 22:29:59.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
Department of Chemical Engineering, University of Massachusetts
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
