Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Tue Oct 25 16:27:46 EDT 2005 | stepheniii
It is not OK to use leadfree BGA's with a lead process. Other parts "should" be reverse compatable. But I first saw problems over 5 years ago with Paladium leads and a lead process. Don't confuse saying "it's ok to use lead free parts in a leaded p
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Wed Jun 29 12:31:32 EDT 2022 | proceng1
I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste). Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that
Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake
No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu
Electronics Forum | Tue Sep 16 16:30:49 EDT 2008 | ck_the_flip
Vlad, yes, he made no mention of a BGA, but I thought I'd just throw it in there. Many people are concerned with the "backward compatible" scenario - running RoHS parts with a Sn/Pb solder paste. The scenario's a no-brainer with most components, bu
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
.gif)
