Electronics Forum | Fri Jan 14 21:44:52 EST 2005 | Chua
Hi, I have component like QFP and connector which is lead free component. And now the process still is leaded process. Pls advise whether I can use the lead free QFP and connector on leaded process. Appreciate the help.....
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Mon Jul 16 10:28:08 EDT 2007 | wana
Thanks guys for the suggestions. But, what I am looking for is data, papers, articles to support this process of using lead free parts in leaded process. Again thanks for any help that you can provide.
Electronics Forum | Sat Jan 15 10:45:04 EST 2005 | Brad
HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.
Electronics Forum | Fri Jul 13 16:07:42 EDT 2007 | wana
Hello All. Can the experts in the lead free field guide me to the articles / data confirming that it is OK to use lead free components in the normal "leaded" (Pb) SMT process. And also if any changes in the process would be required to be made. Th
Electronics Forum | Sat Jul 14 08:49:16 EDT 2007 | davef
While you're waiting for others to respond, search the fine SMTnet Archives.
Electronics Forum | Thu Jul 19 09:23:52 EDT 2007 | patrickbruneel
Chris, To my knowledge the only difference between leaded and lead-free components is the termination plating. What has changed in the component design that makes them resistant to higher temperatures?
Electronics Forum | Sat Jan 15 23:58:24 EST 2005 | Chua
Could you advise what is the min and max peak temperature for this process. Presently, my leaded peak temperature at the range of 215 - 225 deg.C And how do I know that the solderability is at optimal. Appreciate your help......
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Mon Jul 16 11:04:21 EDT 2007 | davef
You want published articles? Look here: http://www.google.com/search?sourceid=navclient&ie=UTF-8&rls=GGLC,GGLC:1969-53,GGLC:en&q=leadfree+in+snpb
