Industry Directory | Manufacturer
www.reflowsystems.com, your site for hi-tech reflow ovens: small benchtop models for prototyping and large conveyor models. Our speciality: 1) leadfree and BGA soldering, 2) zero defect profile builder, 3) energysaving passive mirror heaters !
Industry Directory | Consultant / Service Provider / Events Organizer / Media / Publisher / Online Resource / Training Provider
On site and online Training and consultancy in electronics manufacture. Wide range of training products which are solder worldwide by IPC, SMTA, SMART Group and others
8 Zones Lead-free Reflow Oven High quality lead-free Reflow Oven, reflow soldering, reflow soldering oven, SMT reflow oven, soldering oven, IR reflow, SMD soldering machine, for SMT LED production line. ❙ Introduce of Reflow Oven 1. Control Syst
Lead-Free SMT PCB LED Reflow Solder Oven ❙ Introduce of Reflow Oven High performance Reflow Oven, available in 6 zones, 8 zones and 10 zones. PC + Siemens PLC control system, first-class heating module. the reflow oven important parts use famous
Electronics Forum | Mon Mar 13 10:45:44 EST 2006 | muse95
The original issue was Co. does not need to go Pbfree, but some BGA's they use are only available Pbfree. They don't want to throw away Pb BGA stock, so some boards might have a combination of both Pb and Pbfree BGAs. The question basically was Shou
Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp
Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Industry News | 2016-10-20 19:46:11.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
8 Zones Lead-free Reflow Oven High quality lead-free Reflow Oven, reflow soldering, reflow soldering oven, SMT reflow oven, soldering oven, IR reflow, SMD soldering machine, for SMT LED production line. ❙ Introduce of Reflow Oven 1. Control Syst
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
| https://www.smtfactory.com/High-Speed-SMT-AOI-Machine-in-PCB-Board-Off-Line-Model-I-C-T-V8-pd48670624.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
