Technical Library: leg length (Page 1 of 2)

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Technical Library | 2012-06-21 23:06:06.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion

Alcatel-Lucent

Graphene electronic fibres with touch-sensing and light emitting functionalities for smart textiles

Technical Library | 2019-08-29 13:04:55.0

The true integration of electronics into textiles requires the fabrication of devices directly on the fibre itself using high-performance materials that allow seamless incorporation into fabrics. Woven electronics and opto-electronics, attained by intertwined fibres with complementary functions are the emerging and most ambitious technological and scientific frontier. Here we demonstrate graphene-enabled functional devices directly fabricated on textile fibres and attained by weaving graphene electronic fibres in a fabric. Capacitive touch-sensors and light-emitting devices were produced using a roll-to-roll-compatible patterning technique, opening new avenues for woven textile electronics. Finally, the demonstration of fabric-enabled pixels for displays and position sensitive functions is a gateway for novel electronic skin, wearable electronic and smart textile applications.

University of Exeter, College of Engineering, Mathematics and Physical Sciences

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Technical Library | 2010-03-30 21:51:23.0

This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.

Flex (Flextronics International)

Enhancing Mechanical Shock Performance Using Edgebond Technology

Technical Library | 2014-06-26 16:43:12.0

Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.

Cisco Systems, Inc.

Low-Cost Inkjet Printing Technology for the Rapid Prototyping of Transducers

Technical Library | 2017-06-08 17:31:23.0

Recently, there has been an upsurge in efforts dedicated to developing low-cost flexible electronics by exploiting innovative materials and direct printing technologies. This interest is motivated by the need for low-cost mass-production, shapeable, and disposable devices, and the rapid prototyping of electronics and sensors. This review, following a short overview of main printing processes, reports examples of the development of flexible transducers through low-cost inkjet printing technology.

DIEEI-University of Catania

Challenges of Manufacturing with Printed Circuit Board Cavities

Technical Library | 2021-01-06 20:28:58.0

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB

Intel Corporation

Additive manufacturing frontier: 3D printing electronics

Technical Library | 2020-09-16 21:20:37.0

3D printing is disrupting the design and manufacture of electronic products. 3D printing electronics offers great potential to build complex object with multiple functionalities. Particularly, it has shown the unique ability to make embedded electronics, 3D structural electronics, conformal electronics, stretchable electronics, etc. 3D printing electronics has been considered as the next frontier in additive manufacturing and printed electronics. Over the past five years, a large number of studies and efforts regarding 3D printing electronics have been carried out by both academia and industries. In this paper, a comprehensive review of recent advances and significant achievements in 3D printing electronics is provided. Furthermore, the prospects, challenges and trends of 3D printing electronics are discussed. Finally, some promising solutions for producing electronics with 3D printing are presented.

Xian Jiaotong University

Coating Drug-eluting Arterial Stents Using Ultrasonic Spray Nozzles

Technical Library | 2009-02-04 21:49:02.0

One proven method used to treat clogged arteries employs tubular, mesh-like metal structures, known as stents, inserted into an affected artery to relieve the blockage. Bare metal stents often cause a condition called restinosis, the buildup of scar tissue around the stent, causing re-blockage. To counter this, polymer coatings containing drugs that are released over time are used to inhibit restinosis. Applying coatings to stents, which have intricate geometries, is challenging. Using ultrasonic atomizing spray nozzles has proven effective in achieving continuous and uniform coatings. This paper describes the unique nozzle designs employed, the methodology used, and the results obtained.

SONO-TEK CORPORATION

Challenges of CAD Development for Datapath Design

Technical Library | 1999-05-06 14:19:44.0

In many high-performance VLSI designs, including all recent Intel microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. The circuit and layout of such structures are largely kept the same for each bit slice to achieve maximal performance, higher designer productivity, and better layout density. There are very few tools available to automate the design of a general datapath structure, most of which is done manually...

Intel Corporation

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.

SEMATECH

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